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R&D @ IFCA. Jornadas Futuros Aceleradores , Ciemat Dec 2nd ‘09. Iván Vila Álvarez Instituto de Física de Cantabria. R&D at IFCA in a nutshell(1) - Players. Physicists: Celso Martínez, Alberto Ruíz, Marcos Fernández, Amparo L. Virto & Iván Vila. Students: Jordi Duarte, Francisca Muñoz. - PowerPoint PPT Presentation
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Jornadas Futuros Aceleradores, Ciemat Dec 2nd ‘09
R&D @ IFCA
Iván Vila Álvarez Instituto de Física de Cantabria
R&D at IFCA in a nutshell(1) - Players
Physicists: Celso Martínez, Alberto Ruíz, Marcos Fernández, Amparo L. Virto & Iván Vila.
Students: Jordi Duarte, Francisca Muñoz. Engineer: David Moya (mechanics),
Richard Jaramillo (electronics) and J. Gonzalez (software).
2Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
R&D at IFCA in a Nutshell(2) Technology Network
3Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
uStrips Sensors
Transparent Sensors
Double Metal LayerThin Sensors5th GICSERV
CNMSensors
3th, 4th GICSERV
HPKSensors
ALIVABA
FOS Sensors
FOS in CFC
FOS for EMC DCS
FOS in Silicon
Geometry optimization:Simulation
R&D at IFCA in a Nutshell (&3) - Targets
Technology Driven project
4Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
5Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
Outline: R&D lines
R&D on sensors Improved IR-semitransparent sensors. Thinned micro-strips sensors with integrated pitch
adaptors and embedded FOS. R&D on mechanics
Integration of Fiber Optic Sensors on Silicon and CF composites
Outlook
6Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
7Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
RD on Sensors: IRuS for alignment
Statement of the issue: Real time position monitoring of the tracker during
detector operation with a few microns accuracy. Reference laser lines going through tracker’s sensors. Name of the game, increase the IR transmittance of
the microstrip sensors introducing minimal modifications to the sensor layout: same materials, avoid fine tuning.
R&D targets: ILD FTD, SiD tracker, CMS tracker upgrade,
AIDA
8Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
RD on Sensors: IRuS for alignment (2)
1st Validation of optical simulation software. (done) 2nd Babysensor baseline design (p on n; AC coupling,
50 um pitch) minimal design modifications to boost sensor IR transmittance. (done)
3th Production of IR mini-sensors. (done) 4th Bench testing of sensors (components ready ) 5th Sensors irradiation (optical effects) and beam
testing (SNR) 6th Know-how transfer to main vendors.
Optical computation validation:
9Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
Incidence plane1. Validation of optical
simulation software with material samples (planar multilayer samples) Optain optical parameters
2. Validation of optical simulation for layered diffraction grating.
3. Optical simulation of optical test structures and actual sensors.
Difference calibrated-fitted thickness= 2 nm
• Simulation predicts calibrated thickness of 6 calibrated bands of SiO2 [d=0-500] nm on a 1-sided polished Si wafer,
from Ocean Optics
• Si characterized from 1st band (not shown)
Difference calibrated-fitted
thickness= 1 nm !!
CEC Meeting, Apr 09 - Marcos Fernandez -IFCA 9
Validation optical simulation: Materials
10Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
CNM wafer + diffraction Al pattern, using GICSERV07 access.
40 diffraction orders45 nm Al roughness
CEC Meeting, Apr 09 - Marcos Fernandez -IFCA 12
Validation Optical Simulation: diffraction pattern
11Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
IR transparent mini-sensors Final-Design
OPTICAL TEST STRUCTURES
12Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
SiO2 P1 948.0 nmSiO2 GO 49.5 nmP+ / Si / n+ 295 µm
SiO2 P1 996.8 nm
SiO2 P1 929.4 nmSiO2 FO 1002.7 nm
Si / n+ 295 µmSiO2 P1 980.5 nm
SiO2 P1 928.4 nmSiO2 FO 1002.7 nm
Si / n+ 295 µmSiO2 P1 982.5 nm
SiO2 P1 949.9 nmSiO2 FO 1002.7 nm
Si / n+ 295 µmSiO2 P1 1003.4 nm
OTS1 OTS2
OTS3 OTS4
• Test structures simulated(no fit involved)
• n+ and p+ taken optically identical to Si
%T meas%T sim
%R meas%R sim
Sensor measurement vs. calculations.
13Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
Final outcome projection
After last pasivation layerTmax > 60% (7 layers)
Compare with 25% @ CMS
14Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
Absolute accuracy Determination Direct comparison with interferometric
measurement (accuracy better than 1 um).
4th EUDET Annual Meeting, U. Geneve, 20th October '09, I. Vila
Interferometer reflector
Sensor to be calibrated
Wollaston prism
Laser Paths
Reference granite bench
Preliminary result with CMS ASPD Sensor
Precision below one micron, accuracy < 1.5 um
16Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
-2
-1
0
1
2
3
4
5
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
almy idaalmy vueltainterferometro idainterferometro vuelta
MIC
RON
S
Steps (30 mm)
SiTRA Alignment – HPK Alignment sensors.
4th EUDET Annual Meeting, U. Geneve, 20th October '09, I. Vila
•Two single –sensor modules R/O with APV25 Chips (512ch )
•NIR Transmitance ~ 15-25%
SiTRA Alignment – SPS Test beam
4th EUDET Annual Meeting, U. Geneve, 20th October '09, I. Vila
AIM: Assessment of SNR for backside removed metallization.
Comparison between track-based and laser alignment.
Testbeam at CERNs SPS(19. to 26. August 2009)
• CERN SPS North Area: H6B• We used the EUDET Beam Telescope
to get triggers and tracksResults• About beam 100Kevents + laser
100Kevents.• Analysis still in progress
Preliminary TB results
SNR sensor scanning comparing Back side with Al vs. n Back side with Al metallization
4th EUDET Annual Meeting, U. Geneve, 20th October '09, I. Vila
Alignmentpassage
Particle BeamScanning points
R&D on sensors: Thinned ustrips
GICSERV09 access on ustrip thin sensors.
Direct wafer bonding and deep anisotropic etching.
Aim: frame layout design, FEA analysis, mechanical characterization of dummies, bonding tests, bench & test beam testing.
20Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
Figure 2: Thinning of double-sided processed detectors. See text and ref. [6] for further details.
Integrated sensor and chip interconnects
213th Int. Workshop ,8th October '09, I. Vila
Second metal layer for routing and adapting the pitch.
Different geometries are tested. Run to be launch in January
Silicon Optical sensors Reloaded
GAPD optical optimization ?
22Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
23Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
24Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
R&D on mechanics: Bragg grating
Fiber Bragg Grating optical transducer very common to measure strain and temperature
R&D on mechanics: Bragg grating
25Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
Basic system
263th Int. Workshop ,8th October '09, I. Vila
Large Bandwidth
Light source
Optical Spectrum Analyzer
B1
B2 B3
Bn
1x2 coupler
The number of different Braggs The number of different Braggs is more than 100; moreover by is more than 100; moreover by using an optical switching we using an optical switching we can use tents of sensing fiber can use tents of sensing fiber
OFS & FBG advantages
27Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
Current R&D activities (OCT’ 09) MECHANICAL DUMMIES & multi-groove wafer structures. Exp. validation of FEA simulations. Conventional KOH anisotropic etching on SOI wafer.
283th Int. Workshop ,8th October '09, I. Vila
Current R&D activities and plans
Preparation of experimental test stand (profilometer + miniclimate chamber and tensile test machine): Fiber embedding quantitative evaluation. Validation of FE simulation and extraction of
mechanical parameter for thin layers. Equipment (profilometer) delivered this week. Thermal test of instrumented dummies to be
completed at IFIC
293th Int. Workshop ,8th October '09, I. Vila
OFS work plan – Integration on CF
Integration on CF composite part of CMS R&D Currently working collaboration agreement with
Spanish Aerospace Agency (INTA) for a two year period.
The preliminary plan includes: Complete the market survey. Proposal of fiber routing for CMS upgraded tracker Testing of standalone fibers (irradiation). CF test structures with bonded or embedded fibers. Mechanical expansion and compression test under several thermal
and humidity conditions. Experimental validation of OFS vs. electrical expansion gauges. Comparison with FEA simulations
303th Int. Workshop ,8th October '09, I. Vila
31Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
Integrating OFS & carbon fiber composites
For the Track structure would be interesting to use a embedded fiber optic sensor.
more precise and reliable data It could be use 2 side solution
Better understanding of the results
Useful to quantify the thermal strain
What about DEPFETS?
During the thinning process V-groove could be also etched.
323th Int. Workshop ,8th October '09, I. Vila
Integration on other Vertex supporting structures very doable
Summary
OFS is a proven technology suitable for building a very fast deformation and temperature monitorZero impact on the system material and heat dissipation, and 100% EMCOther monitoring quantities are in the technology scope: humidity, B field, CO2Initial R&D embedding fibers on Silicon.Preparing R&D on fiber embedding on FC.
333th Int. Workshop ,8th October '09, I. Vila
Plans
R&D Targets: ILD, SiD, SCMS, SBelle Current activities:
Market survey and contact with OFS vendors Contacting CF producers (Inta, Fermilab,…)
Next activities: Testing of standalone OFS. Prepare CFRP test samples with embedded OPS Preparing some CF test structures with bonded or embedded
fibers. Mechanical and thermal characterization of the test structures.
34Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
Short-term Outlook
In 2010: The IR alignment sensor fully tested with laser
and source test bench using ALIVABA electronics.
Irradiation and test beam of IR sensors Thin, integrated pitch adaptors sensors tested
at test bench with APV25 OFS proof of principle for tracking and pixel
structural and environmental monitoring. Other sensing technologies.
35Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila
GRACIAS
36Jornadas Sobre Futuros Aceleradores , Ciemat Dec 2ndl '09, I. Vila