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Large size detectors CERN TS-DEM-PMT Capabilities. Rui de Oliveira TS-DEM. Contents. Large size GEM Process and present limitations at CERN Quality control Bulk Micromegas Process and existing equipment possibilities at CERN Quality control THGEM Process and present limitation at CERN - PowerPoint PPT Presentation
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CERN
Rui de Oliveira TS-DEM
Rui de Oliveira
TS-DEM
Large size detectorsCERN TS-DEM-PMT
Capabilities
CERN
Rui de Oliveira TS-DEM
ContentsContents
• Large size GEM– Process and present limitations at CERN– Quality control
• Bulk Micromegas – Process and existing equipment possibilities at CERN– Quality control
• THGEM– Process and present limitation at CERN
• Read out boards– Structure and limitation at CERN
• Conclusions
CERN
Rui de Oliveira TS-DEM
ContentsContents
• Large size GEM– Process and present limitations at CERN– Quality control
• Bulk Micromegas – Process and existing equipment possibilities at CERN– Quality control
• THGEM– Process and present limitation at CERN
• Read out boards– Structure and limitation at CERN
• Conclusions
CERN
Rui de Oliveira TS-DEM
Raw material
Single side Copper patterning
Chemical Polyimide etching
Chemical Copper reduction
Chemical conical single maskChemical conical single mask
GEM production
GEM production2 meter x 450mm
100 meter x 500mm 100 meter x 600mm 2 meter x 600mm
2 meter x 600mm
2 meter x 600mm2 meter x 600mm2 meter x 600mm
2 meter x 600mm
Resist development
Resist lamination UV exposureRaw material
Copper etchPolyimide etchMicro-etch
DryingGEM
CERN
Rui de Oliveira TS-DEM
650mm
650mm
Biggest GEM produced this year
2 GEMs glued together
Biggest GEM produced this year
2 GEMs glued together
CERN
Rui de Oliveira TS-DEM
ContentsContents
• Large size GEM– Process and present limitations at CERN– Quality control
• Bulk Micromegas – Process and existing equipment possibilities at CERN– Quality control
• THGEM– Process and present limitation at CERN
• Read out boards– Structure and limitation at CERN
• Conclusions
CERN
Rui de Oliveira TS-DEM
Quality controlQuality control
• Microscope optical measurement – on several points on the GEM
– Copper hole : 70 ± 2 μm
– Polyimide hole : 55 ± 5 μm
• High voltage test– < 10nA @ 600V for 100mm x 100mm
– @ 35%HR max
And… *new* Light Transmission measurement
CERN
Rui de Oliveira TS-DEM
Good qualityGEM A: 70 μm copper hole, 47 μm polyimide holeTransmission = 9.5% ± 0.5% max over all surface
Bad qualityGEM B: 83 μm copper hole, 55 μm polyimide holeTransmission = 13.5% ± 4% max over the all surface
Light transmission measurement
Light transmission measurement
CERN
Rui de Oliveira TS-DEM
ContentsContents
• Large size GEM– Process and present limitations at CERN– Quality control
• Bulk Micromegas – Process and existing equipment possibilities at CERN– Quality control
• THGEM– Process and present limitation at CERN
• Read out boards– Structure and limitation at CERN
• Conclusions
CERN
Rui de Oliveira TS-DEM
Read-out board
Laminated photoimageable coverlay
Frame
Stretched meshon frame
Laminated photoimageable coverlay
Exposure, developmentand curing
Micromegas BulkMicromegas Bulk
Stretched mesh 1500 x 500 Laminator 600 x 1500 Exposure 2000 x 600
Development 600 x1500
Milling 1500 x 600
Oven 1500 x 500
Detector 1500 x 500
With present equipment
CERN
Rui de Oliveira TS-DEM
ContentsContents
• Large size GEM– Process and present limitations at CERN– Quality control
• Bulk Micromegas – Process and existing equipment possibilities at CERN– Quality control
• THGEM– Process and present limitation at CERN
• Read out boards– Structure and limitation at CERN
• Conclusions
CERN
Rui de Oliveira TS-DEM
DetectorProbe
needles Locating pins
Test: current < 20 nA @ 800V @ 35% HR maxNo standard tool for test!
QUALITY CONTROL
Bed of nails
QUALITY CONTROL
Bed of nails
CERN
Rui de Oliveira TS-DEM
ContentsContents
• Large size GEM– Process and present limitations at CERN– Quality control
• Bulk Micromegas – Process and existing equipment possibilities at CERN– Quality control
• THGEM– Process and present limitation at CERN
• Read out boards– Structure and limitation at CERN
• Conclusions
CERN
Rui de Oliveira TS-DEM
Raw material
CNC drilling
Electrodes etching
Small rim if needed
Copper THGEM production description
Copper THGEM production description
CERN
Rui de Oliveira TS-DEM
• Raw material : 2000mm x 1000mm• Drilling area : 700mm x 600mm
– Drilling cadence : 1 hole per second– Tool life : 10000 holes with 2 sharpenings
• Small rim etching : 1500mm x 800mm• Electrode patterning : 2000mm x 600mm
• Possible Detector size : 700mm x 600mm- 116 hour drilling time for 1mm pitch with 1 head drilling machine
Practical limits ThGEMs at CERN
Practical limits ThGEMs at CERN
CERN
Rui de Oliveira TS-DEM
ContentsContents
• Large size GEM– Process and present limitations at CERN– Quality control
• Bulk Micromegas – Process and existing equipment possibilities at CERN– Quality control
• THGEM– Process and present limitation at CERN
• Read out boards– Structure and limitation at CERN
• Conclusions
CERN
Rui de Oliveira TS-DEM
Read-out boardRead-out board
Single sided: 2000mm x 600mm
Double sided: 1500mm x 400mm
Multi-layer: 600mm x 500mm!
CERN
Rui de Oliveira TS-DEM
ConclusionCERN capabilities
(2008)
ConclusionCERN capabilities
(2008)
• GEM : 2.0 meter x 450 mm
• Micromegas Bulk : 1.5 meter x 500 mm
• ThGEM : 0.7 meter x 600 mm
• Read-out board : 0.6 meter x 500 mm for multi-layer!
