aula8 2 Encapsulamentos.ppt [Modo de...

ELETRÔNICA DIGITAL

Parte 8.2ENCAPSULAMENTO/INVÓLUCRO DE CIs

Prof. Michael

ENCAPSULAMENTO/INVÓLUCRO DE CIs

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Professor Dr. Michael Klug

Classificação

• De acordo com a forma com que eles são montados

nas placas de circuito impresso:

– PTH (pin through-hole) – pinos que passam através de

furos

• DIP: dual-in-line package

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Prof. Michael

– SMT/SMD (surface mount tecnology/device) – tecnologia

de montagem em superfície

• Alternativa de economia de espaço;

• SOIC (small-outline integrated circuit), PLCC (plastic lead chip

carrier), LCCC (leadless ceramic chip carrier), SSOP (shrink small-

outline package), TSSOP (thin shrink small-outline package) e

TVSOP (thin very small-outline package)

PDIP (plastic dual-in-line package)

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Prof. Michael

SOIC (small-outline integrated circuit)

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Prof. Michael

PLCC (plastic lead chip carrier)

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Prof. Michael

LCCC (leadless ceramic chip carrier)

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Prof. Michael

SSOP (shrink small-outline package)

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Prof. Michael

TSSOP (thin shrink small-outline package)

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Prof. Michael

TVSOP (thin very small-outline package)

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Prof. Michael

FBGA (Fine Pitch Ball Grid Array)

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Prof. Michael

PPGA (Plastic Pin Grid Array)

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Prof. Michael

TO-92

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Prof. Michael

TO-220

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Prof. Michael

TO-3

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Prof. Michael