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ELETRÔNICA DIGITAL
Parte 8.2ENCAPSULAMENTO/INVÓLUCRO DE CIs
Prof. Michael
ENCAPSULAMENTO/INVÓLUCRO DE CIs
1
Professor Dr. Michael Klug
Classificação
• De acordo com a forma com que eles são montados
nas placas de circuito impresso:
– PTH (pin through-hole) – pinos que passam através de
furos
• DIP: dual-in-line package
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Prof. Michael
– SMT/SMD (surface mount tecnology/device) – tecnologia
de montagem em superfície
• Alternativa de economia de espaço;
• SOIC (small-outline integrated circuit), PLCC (plastic lead chip
carrier), LCCC (leadless ceramic chip carrier), SSOP (shrink small-
outline package), TSSOP (thin shrink small-outline package) e
TVSOP (thin very small-outline package)
PDIP (plastic dual-in-line package)
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Prof. Michael
SOIC (small-outline integrated circuit)
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Prof. Michael
PLCC (plastic lead chip carrier)
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Prof. Michael
LCCC (leadless ceramic chip carrier)
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Prof. Michael
SSOP (shrink small-outline package)
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Prof. Michael
TSSOP (thin shrink small-outline package)
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Prof. Michael
TVSOP (thin very small-outline package)
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Prof. Michael
FBGA (Fine Pitch Ball Grid Array)
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Prof. Michael
PPGA (Plastic Pin Grid Array)
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Prof. Michael
TO-92
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Prof. Michael
TO-220
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Prof. Michael
TO-3
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Prof. Michael